Advances in CMP Polishing Technologies by Toshiro Doi,Ioan D. Marinescu,Syuhei Kurokawa

By Toshiro Doi,Ioan D. Marinescu,Syuhei Kurokawa

CMP and sprucing are the main specified approaches used to complete the surfaces of mechanical and digital or semiconductor parts. Advances in CMP/Polishing applied sciences for Manufacture of digital units provides the most recent advancements and technological suggestions within the box – making state of the art R&D obtainable to the broader engineering neighborhood.

Most of the functions of those techniques are stored as private as attainable (proprietary information), and particular info are usually not noticeable in specialist or technical journals and magazines. This ebook makes those approaches and functions available to a much broader business and educational audience.

Building at the basics of tribology – the technological know-how of friction, put on and lubrication – the authors discover the sensible purposes of CMP and sprucing throughout quite a few industry sectors. as a result of excessive speed of improvement of the electronics and semiconductors undefined, a number of the offered techniques and purposes come from those industries.

  • Demystifies clinical advancements and technological recommendations, establishing them up for brand new functions and technique advancements within the semiconductor and different components of precision engineering
  • Explores inventory elimination mechanisms in CMP and sprucing, and the demanding situations thinking about predicting the results of abrasive approaches in high-precision environments
  • The authors compile the most recent techniques and learn from america and Japan

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