By Madhavan Swaminathan,Ki Jin Han
3D Integration is being touted because the subsequent semiconductor revolution. This publication offers a finished assurance at the layout and modeling elements of 3D integration, in rather, concentrate on its electric habit. taking a look from the point of view the Silicon through (TSV) and Glass through (TGV) expertise, the publication introduces 3DICs and Interposers as a know-how, and offers its software in numerical modeling, sign integrity, energy integrity and thermal integrity. The authors underscored the potential for this know-how in layout alternate codecs and tool distribution.
- System Integration and Modeling Concepts
- Modeling of Cylindrical Interconnections
- Electrical Modeling of via Silicon Vias
- Electrical functionality and sign Integrity
- Power Distribution, go back course Discontinuities and Thermal Management
- Alternate tools for strength Distribution
Readership: Graduate scholars, lecturers, researchers in electric and electronics engineering, computing device engineering, semiconductors and packaging.
Read Online or Download Design and Modeling for 3D ICs and Interposers: 2 (WSPC Series in Advanced Integration and Packaging) PDF
Similar industrial design books
Protection or convenience? are you able to actually have one with out the opposite? Is it possible to have either? even supposing on no account the one issue, a deep figuring out of biomechanics performs a number one position within the layout of labor and offices which are either soreness and harm loose. status firmly at the origin outfitted through the former variation, the second one version of Biomechanics in Ergonomics establishes an figuring out of gross biomechanical lots at the human process on the tissue point after which brings that knowing via to the entire physique point.
Profitable interplay with items, instruments, and applied sciences will depend on usable designs, accommodating the wishes of power clients and doesn't require high priced education. during this context, Advances in Usability review half I discusses rising techniques, theories, and purposes of human elements wisdom concentrating on the invention and figuring out of human interplay with items and structures for his or her development.
This ebook first describes clinical units relating to regenerative drugs prior to turning to a extra particular subject: synthetic middle applied sciences. not just the pump mechanisms but in addition the bearing, motor mechanisms, and fabrics are defined, together with specialist info. layout tools are defined to reinforce hemocompatibility: major matters are aid of blood mobilephone harm and protein holiday, in addition to prevention of blood clotting.
Alexander Hennig untersucht die auftretenden Interferenzeffekte in Freistrahlwindkanälen sowie deren Korrektur. Im Fokus steht der Versperrungseffekt des Fahrzeugnachlaufs und dessen Interferenzwirkung mit dem Windkanalkollektor. Basierend auf Windkanalstudien wird ein erweitertes Verfahren entwickelt, das den Versperrungseffekt des Nachlaufs realitätsnah abbilden kann.
- Fundamentals and Assessment Tools for Occupational Ergonomics: 1 (The Occupational Ergonomics Handbook, Second Edition)
- Troubleshooting Switching Power Converters: A Hands-on Guide
- Handbook on Advanced Design and Manufacturing Technologies for Biomedical Devices
- Handbook of Turbomachinery (Mechanical Engineering)
- Managing Packaging Design for Sustainable Development: A Compass for Strategic Directions
- Adaptive Techniques for Mixed Signal System on Chip: 872 (The Springer International Series in Engineering and Computer Science)
Extra info for Design and Modeling for 3D ICs and Interposers: 2 (WSPC Series in Advanced Integration and Packaging)