Design and Modeling for 3D ICs and Interposers: 2 (WSPC by Madhavan Swaminathan,Ki Jin Han

By Madhavan Swaminathan,Ki Jin Han

3D Integration is being touted because the subsequent semiconductor revolution. This publication offers a finished assurance at the layout and modeling elements of 3D integration, in rather, concentrate on its electric habit. taking a look from the point of view the Silicon through (TSV) and Glass through (TGV) expertise, the publication introduces 3DICs and Interposers as a know-how, and offers its software in numerical modeling, sign integrity, energy integrity and thermal integrity. The authors underscored the potential for this know-how in layout alternate codecs and tool distribution.

Contents:

  • System Integration and Modeling Concepts
  • Modeling of Cylindrical Interconnections
  • Electrical Modeling of via Silicon Vias
  • Electrical functionality and sign Integrity
  • Power Distribution, go back course Discontinuities and Thermal Management
  • Alternate tools for strength Distribution

Readership: Graduate scholars, lecturers, researchers in electric and electronics engineering, computing device engineering, semiconductors and packaging.

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